The four mainstream technologies are gradually showing how the 2015 packaging pattern will change.

[Text / high-tech LED Xu Chaopeng] In 2014, it was called the replacement year of LED in the industry, and it was also the year of popularization of LED lighting. Among them, domestic LED packaging companies are ushing in rapid development, and China has gradually become the manufacturing center of LED packaging devices in the world.

“Over the whole year of 2014, the domestic LED packaging industry has a good momentum of development, the industry scale has grown steadily, the gap between key technologies and international standards has been further narrowed, innovation and application are basically synchronized with the international market, and the performance of representative companies and listed companies is eye-catching. The pattern accelerated and the brand competition pattern was initially formed.” Dr. Zhang Xiaofei, Chairman of Gaogong LED, said at the 2014 Golden Globe Awards Ceremony.

Indeed, benefiting from the rapid growth of the downstream lighting industry, the LED packaging industry showed a relatively rapid growth in 2014. According to the statistics of the High-tech LED Industry Research Institute (GGII), the scale of China's LED packaging industry reached 56.8 billion yuan in 2014, a year-on-year increase of 20%. The annual growth rate of LED package shipments exceeded 70%.

“In 2014, SMD was still the most mainstream form of packaging, accounting for 52% of the output value of the packaging market. The proportion was improved compared with the previous year. In 2014, mainstream SMD models were mainly 2835, 4014, 5730, 3535, 3030, etc., 2835 The market accounted for more than 50%, and 3528 and 3014 gradually faded out of the market." GGII senior analyst Li Shengfa mentioned.

To this end, the "2014 High-tech LED Golden Globe Award" jointly organized by Gaogong LED and Gaogong LED Industry Research Institute has also established three major awards in the package category: single device, integrated device and flip-chip device, Simai De, Xuyu Optoelectronics, Hongli Optoelectronics finally won the championship.

2014 high-tech Golden Globe Awards package awards and shortlists

After entering 2015, the CSP package extended by flip-chip technology is getting hotter and hotter. Before Jingke Electronics focused on this field for several years, the industry giants such as Hongli and Guoxing successively opened up this battlefield. Therefore, this year's "2015 High-tech LED Golden Globe Award" also set a special CSP package award, which is the "single champion" in the current domestic CSP field.

"A few years ago, flip chip technology has been concerned by the industry, but due to cost, technology and other reasons, the downstream terminal market remains silent, and with the continuous improvement of technology in recent years, the cost of flip chip has been decreasing, while The market acceptance is further improved. Based on the independent gold-free technology, our company has introduced CSP devices with smaller size, better optical and thermal performance, and excellent performance in power, heat, light and electricity, which will be the general trend. Song Jing, vice president and president of Jingke Electronics, said.

In addition, this year's "2015 High-tech LED Golden Globe Award" will continue to set up SMD, COB, EMC three packaging awards, combined with CSP packaging, these four packaging technologies will also be in the long period of time in the future , occupying the status of domestic mainstream packaging.

"EMC (Epoxy Molding Compound) is a highly integrated frame form formed by Molding equipment using new Epoxy materials and etching technology. It has high heat resistance due to changes in materials and structures. Anti-UV, highly integrated, high current, small size. In some specific areas, there are advantages that ceramics and PPA can't match. Since the introduction and use in the packaging field, it has been well applied in backlight." Stanley Marketing Director Zhang Luhua mentioned.

"The LED packaging industry will officially enter the competition elimination period in 2015. The trend of 'big one Evergrande' is more prominent. In 2014, hundreds of packaging companies have been eliminated, with the release of production capacity of listed companies and large-scale enterprises. Traditional packaging devices will enter the era of low profit. I expect that in 2015, China's LED packaging scale will exceed 1 billion enterprises, and industry concentration will be closer to large enterprises." Lin Yu, chairman of Xuyu Optoelectronics, said.

Then, who will become a veritable 'big enterprise' in the LED packaging industry, this year's high-tech LED Golden Globe Award will continue to be open, public and fair, and the most representative and market-recognized for the packaging industry. LED packaging companies.

Are you ready? Which new companies will win the 2015 High-tech LED Golden Globe Award? Can the packaging companies that won the award last year continue to be brilliant? We are looking forward to...

2015 High-tech Golden Globe Awards Enrollment Enterprise List (continuously updated)

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