Product miniaturization technology is already in other products-such as mobile phones and other consumer electronics products-has many years of development and application experience, and related experiments have also been for several years. In the CMET2010 process workshop, Dr. Shangguan Dongkai introduced the application of miniaturization technology in medical devices based on Flextronics' years of experience. There are many microelectronic packaging technologies that can be applied to medical devices.
There are several ways of three-dimensional assembly. One is Package. We use it called in-line. This process was made in Flextronics Laboratory in 2002 and applied to large-scale production in Xixiang factory in 2003. Because at that time the process used is called Package Stacking. What did we do in 2002? Actually doing management and doing in-line, the automatic soldering machine finishes these two at the same time. This process was not applied to a larger scale in industry until 2005 or 06. What are the benefits of this? Mainly from the Package Stacking has greater flexibility, can be two management, now almost used in mobile phones.
I think it can also be applied to this foundation in the miniaturization of medical devices. What other ways to do three-dimensional assembly? There is a lot of space inside the product that has not yet been used. Now we have to miniaturize and increase the functional density. How can we use more space in the product? The flexible board provides us with such an opportunity. For example, integration includes integrated SoC of semiconductor silicon, system in package, and three-dimensional packaging.
And in terms of assembly, there are less than 8 mm, or 0201, 01005 component assembly, three-dimensional assembly, flexible circuit board assembly, etc., these methods can also achieve miniaturization of products at the board level. Specifically, taking the assembly of 0201 and 01005 components as an example, this technology has been used in consumer electronics for five years, but it has not been widely used in medical electronics because it involves micro devices in the process. Relatively high requirements: such as device requirements, PCB board requirements, device flatness, printing process requirements, etc.
And need to consider the inspection after design and manufacturing, as well as the final maintenance and so on. In addition, some devices can be directly integrated into the silicon chip, everyone is familiar with Die Stacking. We usually have to consider the field of use of silicon chips. If the field is relatively low, overlapping a few together will eventually be a layered consideration. Everyone is also familiar with Package Stacking. For example, Embedded Components in PCB is further miniaturized to increase its function and density.
From a functional perspective, especially for soldering robots for high-quality applications, I hope that the distance between the PCB and the silicon chip should be as close as possible. There will be some considerations from Embedded Components in PCB and Flip Chip. There are still many discussions and debates on this issue. Because of how much it affects the cost, we will get some advantages from the aspect of miniaturization and product function, but at the same time will have some impact on the manufacturing cost. How to make this decision is not yet clear. Therefore, some work needs to be done before this technology can be applied to medical equipment.
01005 is mainly the application of the module. The basic process is very similar to 0201, but the process must be further refined. For example, in the selection of solder paste, nitrogen may be used during soldering, and rework may be difficult. . There are many types of Flip Chip, such as Solder Bump can reach 150 microns, there are many things that need to be done to realize the application of Flip Chips in products, what are the requirements of equipment, what are the requirements of technology, etc. Fluxing has a very fine pitch, so it is more difficult to use Flip Chip, and Reflow needs to use nitrogen. Nitrogen does not necessarily require 50 PPIs. Au Stud Bump is used more. In order to further miniaturize, the simplest way is Au Stud Bump.
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