In order to understand the issue of Micro LED's transfer of wafers, Xiaobian found that a company called X-Celeprint launched a technology called μTP in 2014. It is reported that the μTP technology, as an advanced micro-assembly technology, enables hundreds of small (optimally sized sub-millimeter) devices to move precisely at the same time.
The μTP technology was originally developed by John A. Rogers et al. of Illinois University, USA, using a sacrificial layer wet etching and PDMS transfer technique to transfer a Micro LED to a flexible substrate or a glass substrate to fabricate a Micro LED array. Spin-out was given to Semprius, and in 2013 X-Celeprint was granted Semprius technology and started operations in early 2014.
What is μTP technology?
The μTP technology, in simple terms, uses a flexible stamp in combination with a high-precision motion-controlled printhead, a selective array of pick-up micro-components, and prints it onto a target substrate. .
Specifically, the microchip is first fabricated on a "source" wafer, and then "release" is performed by removing a sacrificial layer under the semiconductor circuit to disengage the microchip from the original substrate. The microchip is then picked up using a microstructured elastic stamp that matches the "source" wafer and transferred to the target substrate.
This technique can accurately control the assembly process by changing the speed of the printhead to selectively adjust the adhesion between the elastic stamp and the transferred device. When the stamp moves faster, the adhesion force increases, so that the transferred component is separated from the source substrate; conversely, when the stamp is away from the bonding interface and moves slowly, the adhesion force becomes small, and the printed component is detached. The stamp is then transferred to the target substrate.
The stamps mentioned above can be used to achieve high-speed parallel processing by enabling a single design to pick and print multiple devices in a single design, enabling efficient transfer of thousands of devices in a short period of time.
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