Future technology trends in the LED industry

The 9th China International Semiconductor Lighting Forum and Exhibition (CHINASSL2012), as the world's top LED industry event, directly focuses on the industry game, interprets the latest trends and shows cutting-edge technological achievements and design excellence.

“In the case of packaging, LED packaging plays a role in the whole industry chain. It is also one of the links between China's LEDs in terms of scale and cost in the global industrial division of labor.” The head of the CHINASSL2012 Organizing Committee said: “Since 2011 - Since 2012, the package has evolved from the original in-line (LAMP), SMD (SMD) to high-power integrated package (HighPowerLED) and COB .

The COB packaging technology has once again received wide attention. The latest test report of the National Semiconductor Light-Emitting Device (LED) Application Product Quality Supervision and Inspection Center shows that China has developed a COB package light source with an input current of 20 mA and a luminous efficiency of up to 177 lm/W. LEDs continue to refresh the record of technological innovation, which also marks a new breakthrough in LED packaging.

As the top event in the global LED industry, CHINASSL has been committed to the communication and communication of the latest research and development achievements and technological innovation. This year's CHINASSL2012 (November 5-7, Guangzhou) will launch 7 technical sessions, focusing on cutting-edge technological achievements in various segments of the LED industry chain.

Material and equipment technology

The conference will focus on two major factors limiting the performance improvement and cost reduction of semiconductor lighting products, focusing on high-quality epitaxial material technology and excellent epitaxial equipment.

Thermal management and reliability technology

Mainly related to solid lighting components (including LEDs, optics, drive circuits, control, thermal design, etc.), as well as reliability issues of integrated systems. It will include thermal optimization design at all levels of packaging, modules and systems, new cooling methods, development of test techniques, accelerated test methods and reliability models, modeling and simulation, test standards and software development.

Chip, device, package and module technology

Focus on LED chips and devices to increase efficiency, reduce costs, improve yield, improve reliability, and other key issues. There are mainly problems such as how to improve wafer consistency, reduce chip grading offset loss, and prevent high-quality chip failure due to lack of packaging materials and processes.

Drive, power and control technology

With the continuous improvement of LED lighting penetration and the decline of LED cost, LED drive and control technology has also rapidly grown from a weak one to an important part of the future. The conference will discuss multi-drive technology, ultra-high reliability drive technology, primary constant current control technology, intelligent control technology and intelligent dimming technology.

LED lighting application quality

This conference will share with the world's leading experts the light quality evaluation trends of LED lighting applications, the latest recommendations on quality parameters and standardization issues in visual perception and cognition, biophysics. The content involves but is not limited to: visual comfort/discomfort of LED lighting (such as glare, fatigue, interference light), light characteristics, circadian rhythm, photobiological effects, lighting application standardization and sustainability of LED lighting effects. New results on lighting applications and their lighting solutions will also be discussed.

LED product and lighting engineering design

With the improvement of the quality of LED light, it is possible to compete with traditional light sources in the application. How to develop strengths and avoid weaknesses in LED products and lighting engineering design, to create an ideal light environment? How to ensure light bio-safety, realize variable light color, stepless dimming, fast ignition and make it easy to accept intelligent system control and accelerate standardization The conference will discuss this series of focus issues.

OLED display and lighting

Organic electroluminescent devices (OLEDs) have attracted widespread attention in high-quality flat panel displays and high-performance solid-state lighting applications. The world's top scientists and engineers will be invited to introduce the latest developments in related fields, the broad application prospects of this emerging technology and the latest market trends.