Zhong Kuanren, chairman of the New Century (3383), said that in 2017, the white LED patent of Nissan will be lifted, and the patent competition of the LED industry will enter a new era. Flip chip packaging and wafer level packaging (CSP) will become the main battlefield. The new century is currently only two suppliers that can be stabilized in mass production. After the new century, it is expected to ship in large quantities in the new century. In the second half of the year, the proportion of revenue of the two major products is expected to be 50%.
Zhong Kuanren believes that the LED industry is still in a state of struggle this year, but for the new century is the first year of CSP, CSP technology extends from the flip chip technology, the new century has integrated light, machine, electricity and heat dissipation technologies, no need to package and Integrating key technical issues, the yield has reached 90%. It is also listed as a major supplier with stable supply and no customer complaints. It has already entered the After Market market for car headlights. Up to 10,000 pieces.
Zhong Kuanren pointed out that the white light LED patent of Nichia has been lifted in 2017, and the chip and CSP patents are more important. The front-end factory is subject to the patent of white light. After next year, it will not be affected by patents; CSP can be applied to ultra-thin TV, ultra-thin On the mobile phone and on the flash, the application has a wider downstream estuary and fewer suppliers, and Taiwanese businessmen have the opportunity to step out of the new blue ocean.
When Nichia was banqueting the media last year, it also actively promoted Direct Mountable Chip (DMC). The product was mass-produced in October last year. In the past, the flip chip was only used in the automotive market, and Nichia was seen in the product. To other areas, this year will begin to apply to backlights.
In the new century, the company plans to transfer production capacity as quickly as possible. Since 2011, the company has not significantly increased its production plan. From January to February, it has actively converted production capacity, and the utilization rate has dropped to 5 to 60%. After the Lunar New Year, 2 inch wafers. The whole number will be converted into 4 inch wafers, and the monthly production capacity will be changed from 200,000 to 50,000. The utilization rate is expected to rise in March. It is estimated that by the end of this year, the coverage of CSP products will reach 4~. 50%.
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