Molex zCDTM interconnect products meet next-generation data transmission needs

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Molex , the world's leading electronic components company, develops compact zCD TM interconnect systems to support next-generation applications in telecom, networking and enterprise computing environments. At DesignCon 2014, held in Santa Clara, Calif., January 29-30, 2014, Molex will showcase the zCD interconnect system at booth #117. The Molex zCD interconnect system will deliver 400 Gbps data rates (up to 25 Gbps on 16 channels) with excellent signal integrity, electromagnetic interference (EMI) protection and thermal cooling.

Joe Dambach, global product development manager at Molex, said: "As network bandwidth continues to increase, meeting the needs of high-speed applications has become a common priority for the industry. zCD interconnect products have superior form factors that help achieve 400 Gbps technology. widely used."

The Molex zCD connector will be available in short form for passive or active copper and long form for active optical Cable (AOC) or transceiver. The zCD connector has a straight back-route footprint of 0.75 mm pitch. A resilient washer provides EMI control and suppression. Designed for a wide range of heat sink modules and heat sinks, the press-fit connector design ensures a robust, simple board termination.

The zCD passive copper component features industry-leading bandwidth density with 32-pair (16-channel) per I/O port and a data rate of 25 Gbps. This dual switch card system enhances crosstalk performance through the cable interface, and the embedded microcontroller cable management interface allows for custom host management capabilities over the I2C bus. This passive copper harness (up to 32 pairs) is designed with 30 AWG Twinax cables to increase the bend radius and flexibility of short-range 400 Gbps Ethernet or legacy and proprietary applications.

Molex's AOC components using zCD connectors are based on single-mode silicon photonics and feature a compact standard interface that provides 16 bidirectional channels or 400 Gbps bandwidth running at up to 28 Gbps data rates. A hot-swappable transceiver allows insertion and removal of the device without shutting down the system. Module I/O equalization enables performance optimization of individual host systems. With a transmission range of up to 4km, the zCD AOC component uses a fraction of the cost and power of long-haul optical modules, primarily designed for 400 Gbps Ethernet applications, and will be used in InfiniBand* and proprietary protocol applications.

Dambach added: "The zCD interconnect system provides a high level of integration, performance and long-term reliability for customers requiring 400 Gbps bandwidth for data rates up to 25 Gbps per channel."

Molex is a founding member of the CDFP Multi-Source Agreement (MSA) industry consortium, which specifically defines and promotes the specification of interoperable 400 Gbps hot-swappable modules.