Grand Unified University Group promotes Azurewave tablet Wi-Fi solution and Kingston embedded memory series

Dazhongda Holdings announced that its subsidiary Group has launched Azurewave's tablet Wi-Fi solution and Kingston embedded memory (eMMC, eMCP) and other products.

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Azurewave Tablet Wi-Fi Solution

The main chipset of AW-NU147SM, the Azurewave Wi-Fi solution represented by the Grand Alliance Group, uses Realtek RTL8188ETV/EUS). The AW-NU147SM USB 2.0 Wireless Time Stamping Module is a highly integrated wireless local area network (WLAN) solution that allows users to share digital content with the latest wireless technology without the need for additional cables and wires. It delivers a high performance, cost effective, low power, compact solution that can be easily mounted on the USB side. The AW-NU147SM is compliant with the IEEE 802.11b/g/n standard and uses Direct Sequence Spread Spectrum (DSSS), Orthogonal Frequency Division Multiplexing (OFDM), BPSK, QPSK, CCK, and QAM baseband modulation techniques. By using the AW-NU147SM, high levels of integration and full implementation of the power management features specified in the IEEE 802.11 standard minimize system power requirements.

Features:

· USB 2.0

· Comply with IEEE802.11n standard

· 1 antenna supports 1 transmission and 1 reception

· High-speed wireless connection up to 150Mbps

· Low power consumption and high performance

· Cost-effectiveness

· Enhanced wireless security

Grand Unified University Group promotes Azurewave tablet Wi-Fi solution and Kingston embedded memory series

Graphic - module photo

The main chipset of the Azurewave composite solution AW-NU168SM is the first IEEE802.11b/g/n WLAN and Bluetooth time-scale module using Realtek RTL8723BS. Time-scale modules are devices for mobile devices that require small packages, low power, multiple interfaces, and operating system support, including personal digital assistants (PDAs), netbooks, tablets, and gaming devices. By using the AW-NB168SM, customers can easily enable Wi-Fi and BT embedded applications with high design flexibility benefits, shortening the development week and accelerating time to market.

For video, voice and multimedia applications, the AW-NB168SM supports 802.11e Quality of Service (QoS); for Bluetooth operation, the AW-NB168SM is compliant with Bluetooth 4.0+3.0 High Speed ​​(HS) and Bluetooth 2.1+ Enhanced Data Rate (EDR) ). Bluetooth 3.0 + HS makes it easier to connect to the AW-NB168SM to support SDIO WLAN host processors. The provided UART interface can be connected to the BT core host processor.

Features:

· Small footprint: 14mm (length) x 14mm (width)

· SDIO interface supports WLAN

· UART Bluetooth

· Bluetooth 4.0 + High Speed ​​(HS), also compatible with Bluetooth 2.1 + Enhanced Data Rate (EDR)

· Low power consumption

· Advanced and secure IEEE 802.11i

· Multimedia Application Quality of Service (QoS) support

· Drip-in WLAN Linux driver Android ready and Android based system verified.

· Direct support for Wi-Fi (WFA P-2-P standard)

· Lead-free design

Grand Unified University Group promotes Azurewave tablet Wi-Fi solution and Kingston embedded memory series

Graphic - block diagram

Azurewave's 4-in-1 solution The main chipset for the AW NS145SM is the MTK MT6620, an IEEE 802.11b/g/n WLAN, BT, GPS and FM TX/RX combined time-scale module. With four advanced radio technologies integrated in a time-scale module, the AW-NS145 offers the best and most convenient SMT process. The module targets mobile devices that require convenient SMT technology, low power consumption, multiple operating systems (Android, Windows mobile, Linux, Symbian), including tablets, portable media players (PMPs), portable navigation devices (PNDs), individuals. Digital assistants (PDAs), tracking devices, gaming devices.

By using AW-NS145, customers can easily integrate Wi-Fi, BT, GPS and FM through a time-scale card module to achieve high module design flexibility, high success rate of SMT process, short development cycle and fast time-to-market. .

Features:

· The AW-NS145 is a 4-in-1 wireless communication time-scale module that includes WLAN, Bluetooth, GPS and FM transmitters and receivers.

· Small footprint: 15mm (length) x 15mm (width) x 1.60mm with shielding (high, maximum)

· Solder spacing: 1.3mm

· Coexistence: IEEE 802.15.2 external three-wire coexistence scheme to support more wireless technologies such as 3G and WiMAX

· Optimal current consumption performance

· Intelligent BT/WLAN coexistence schemes surpass PTA signals (for example, considering the transmission window and duration of account protocol exchange sequences, frequencies, etc.)

· Lead-free / halogen-free design

Grand Unified University Group promotes Azurewave tablet Wi-Fi solution and Kingston embedded memory series

Graphic - block diagram

Kingston Tablet Embedded Memory Products

The products of the Kingston embedded memory series represented by the Grand Alliance Group include MCP, eMCP and eMMC. These products are designed, developed and manufactured in Taiwan. The marketing service strategy provides real-time supply stability, on-site service and product flexibility to Asian customers. A variety of products can be applied to tablets, PAD and PadPhone.

Graphic - Kingston's embedded memory products for tablets

Graphic - Kingston's embedded memory products for tablets

Features:

Universal:

· Package: 153 ball FBGA type, 11.5mm x 13mm x 1.0mm (minimum), 0.5mm pitch

· Package: 169 ball FBGA type, 12mm x 16mm x 1.0mm (minimum), 0.5mm pitch

· Lead-free (RoHS-compliant) and halogen-free

· Independent E•MMCTM and LPDRAM interfaces

· Operating temperature range: -25 ° C to +85 ° C:

· Storage temperature range: -40°C to +85°C

e•MMCTM- NAND:

· NAND flash memory packaged with e•MMCTM 4.5 interface

· Also e•MMCTM grid Ver.4.4, 4.41 and 4.5

· Bus mode: high-speed e•MMCTM protocol; provides 0-200MHz variable clock frequency (according to JEDEC specification); top ten bus (clock, 1-bit command, 8-bit data bus) and hardware reset

· Supports three different data bus widths: 1 bit (default), 4 bits, 8 bits; data transfer rate up to 52Mbyte/s (using 52MHz 8-bit parallel data line); single data rate high 200Mbyte/s @ HS200( Host clock @200MHz); double data rate up to 104Mbyte/s @ 52MHz

· Support (alternative) boot mode, providing a simple boot sequence method

· Support sleep / wake up (CMD5)

· The host's explicit power-saving sleep mode

· Enhanced write protection with permanent and partial protection options

· Support for multi-user data partitions with enhanced user data area options

· Support for background operations and high priority interrupts (HPI)

· Enhanced storage media features that support higher reliability

· Operating voltage range: VCCQ = 1.8 V / 3.3 V; VCC = 3.3 V

· System performance: DDR mode; multi-block read (X8 is 52MHz) up to 85Mbyte/s; multi-block write (X8 is 52MHz) up to 12Mbyte/s

· Error-free memory access: internal error correction code (ECC) to protect data communication; internal enhanced data management algorithm; solid guarantee for sudden power failure security update operation of data content;

· Security: Supports secure bad area erase commands; enhances write protection with permanent and partial protection options

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Features
1.Best for supporting conductors
2.Helps to maintain high voltage in high loads
3.Used in electrical wiring and cables for insulation]
4.Robust build
5.Corrosion less

Parameter

Type XHP-70 XHP-70C XHP-80 XHP-80C XHP-100 XHP-120
Porcelain Disc Diameter,D.mm 254 254 254 254 254 254
Unit Spacing,H.mm 146 146 146 146 146 146
Standard Coupling to IEC 120&471 16B 16C 16B 16C 16B 16B
Creepage Distance,mm 432 432 432 432 432 432
Combined M&E Strength,KN 70 70 80 80 100 120
Routine Test Load,KN 28 28 32 32 40 48
Power Frequency Flashover Voltage Dry, kv  90 90 90 90 90 90
Wet, kv  50 50 50 50 50 50
50% Impulse Flashover Voltage,KV 125 125 125 125 125 125
Power Frequency Withstand Voltage Dry., kv  80 80 80 80 80 80
Wet., kv  45 45 45 45 45 45
Impulse Withstand Voltage,KV 115 115 115 115 115 115
Power Frequency Puncture Voltage,KN 120 120 120 120 120 120
Net Weight, Each Approx., kg 6.5 6.8 6.5 6.8 7.5 7.8

disc insulator XHP-70,80,100,120disc insulator XHP-70C,80C

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MAIN DIMENSIONS AND STANDARD PARTICULARS
Type 52-1 52-2 52-3 52-4 52-5 52-6 52-9
Porcelain Disc Diameter,D.mm 152 190 254 254 254 254 108
Unit Spacing,H.mm 140 146 146 146 146 146 160
Creepage Distance,mm 178 210 292 292 292 292 171
Combined M&E Strength,KN 44 67 67 67 111 111 44
Impact Strength,N-m 5 5.5 6 6 7 7 5
Routine Proof Test Load,KN 22 33.5 33.5 33.5 55.5 55.5 22
Time Load Test Value 27 44 44 44 67 67 27
Low Frequency Flashover Voltage Dry, kv  60 65 80 80 80 80 60
Wet, kv  30 35 50 50 50 50 30
Critical Impulse Flashover Voltage Pos., kv  100 115 125 125 125 125 100
Neg., kv  100 115 130 130 130 130 90
Low Frequency Puncture Voltage,KV 80 90 110 110 110 110 80
Radio Influence Voltage Data Test Voltage to Ground,KV 7.5 7.5 10 10 10 10 7.5
Max.RIV at 1000KHZ,UV 50 50 50 50 50 50 50
Net Weight, Each Approx., kg 2.5 3.5 4.6 4.6 5.5 5.5 2.5
disc insulator 52-1disc insulator 52-3

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