Although the LGA1366 and LGA1156 interfaces currently occupy the high-end and low-end markets, respectively, the LGA1155 new interface Sandy Bridge processor is also coming soon, but the old and long-lived LGA775 still has a large living space, Intel also issued a notice again today, announced that the LGA775 processing The original radiator is adjusted again. In fact, in early March of this year, Intel had a similar move, LGA775 original radiator fan blades, central shaft, cooling fins, cooling base, heat sink, etc. have made changes, the whole has obviously shrunk, but Intel Claimed to have no effect on the cooling effect.
After adjusting again, the base of the LGA775 original radiator is a small circle, but the overall size, fan installation, screw holes, etc. remain unchanged, Intel also said it will not affect the thermal performance, users will not use it Feel any different.
The new radiators will be shipped from January 31st, 2011. Existing models will continue to be available until inventory is cleared. Therefore, there may be two radiators on the market at one time.
The spread boxed processor products include some models of the Core 2 Quad Q9000/Q8000 series, Core 2 Duo E8000/E7000 series, Pentium E6000/E5000 series, and Celeron E3000 series.