[Text|High-tech LED reporter Luo Shenghua] "So far, no matter which generation of products, there will be no disappearance, even the most original two-pin plug-in LED, there is still a large share of the home flashlight and IR market. LED, There will never be a last product, only the next one.†In an interview with Gao Gong LED reporter, Li Kun cone, director of Hongli Optoelectronics Engineering Technology Center, said.
In 2014, most people in the industry called LED lighting a critical year for explosive growth. The technical performance of LED application products has gradually stabilized and prices have dropped rapidly. The demand in the downstream application market, especially in the lighting field, has surged, which indirectly drives the packaging capacity of the midstream. digestion. According to the statistics of the High-tech Research Institute LED Research Institute (GGII), the total output value of China's LED packaging in 2014 was 56.8 billion yuan, a year-on-year increase of 20%. Since 2014, local packaging has been expanding in production capacity while product technology has been expanding.
In general, the package has experienced different technological development stages such as in-line LED, PPA-SMD, EMC, COB, CSP, etc., and different package forms are cross-developed and developed together.
"As an initial package, the SMD market is becoming more and more fierce. If there is no new structure, there will be a lower price after homogenization. The SMD market is entering the 'World War I' in the LED industry." The development status of each package form, Li Kun cone evaluation.
As the leader of China's white LED devices, the current monthly production capacity of Hongli Optoelectronics is about 1500KK. In addition to the outstanding performance of the business scale, at the technical level, Hongli Optoelectronics is the first LED packaging company in China to pass the LM-80 test, and is committed to technological innovation of the product.
"Before everyone agreed that local packaging companies can't compete with overseas companies in terms of high light efficiency and high luminous flux. In fact, this is not right." Li Kun said.
As Li Kun cone said, in the field of general lighting, local packaging companies have occupied an absolute advantage with their price advantage and service capability. And gradually penetrate into the special lighting fields such as automotive lighting and plant lighting.
However, although the technology of LED packaging is moving forward, there are still some unsolved problems. For example: Why is the package now containing a lot of organic materials; the metal soldering of the chip replaces the traditional DIE BOND when it arrives; the remote isolation is indifferent, will it be closer to the point; why is the LED so much plastic material?
With these questions, the 13th High-tech LED Industry Summit Forum 2015 will be held on June 8th at Langham Place, Guangzhou Nanfeng. At that time, Li Kun cone, director of Hongli Optoelectronics Engineering Technology Center, will give a wonderful speech with the theme of "Technology Innovation of LED Packaging". We will continue to make technical analysis and predictions on the status quo and development trends of various types of packaging.
In 2014, most people in the industry called LED lighting a critical year for explosive growth. The technical performance of LED application products has gradually stabilized and prices have dropped rapidly. The demand in the downstream application market, especially in the lighting field, has surged, which indirectly drives the packaging capacity of the midstream. digestion. According to the statistics of the High-tech Research Institute LED Research Institute (GGII), the total output value of China's LED packaging in 2014 was 56.8 billion yuan, a year-on-year increase of 20%. Since 2014, local packaging has been expanding in production capacity while product technology has been expanding.
In general, the package has experienced different technological development stages such as in-line LED, PPA-SMD, EMC, COB, CSP, etc., and different package forms are cross-developed and developed together.
"As an initial package, the SMD market is becoming more and more fierce. If there is no new structure, there will be a lower price after homogenization. The SMD market is entering the 'World War I' in the LED industry." The development status of each package form, Li Kun cone evaluation.
As the leader of China's white LED devices, the current monthly production capacity of Hongli Optoelectronics is about 1500KK. In addition to the outstanding performance of the business scale, at the technical level, Hongli Optoelectronics is the first LED packaging company in China to pass the LM-80 test, and is committed to technological innovation of the product.
"Before everyone agreed that local packaging companies can't compete with overseas companies in terms of high light efficiency and high luminous flux. In fact, this is not right." Li Kun said.
As Li Kun cone said, in the field of general lighting, local packaging companies have occupied an absolute advantage with their price advantage and service capability. And gradually penetrate into the special lighting fields such as automotive lighting and plant lighting.
However, although the technology of LED packaging is moving forward, there are still some unsolved problems. For example: Why is the package now containing a lot of organic materials; the metal soldering of the chip replaces the traditional DIE BOND when it arrives; the remote isolation is indifferent, will it be closer to the point; why is the LED so much plastic material?
With these questions, the 13th High-tech LED Industry Summit Forum 2015 will be held on June 8th at Langham Place, Guangzhou Nanfeng. At that time, Li Kun cone, director of Hongli Optoelectronics Engineering Technology Center, will give a wonderful speech with the theme of "Technology Innovation of LED Packaging". We will continue to make technical analysis and predictions on the status quo and development trends of various types of packaging.
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