The semiconductor lighting industry is facing a rare historical opportunity. The output of LED packaging and application products in China has accounted for 70% of the world's total. The development of the LED industry is taking advantage of the development of the LED industry. It is actively developing in the direction of advantages, promoting technological progress and maturity of production processes, thus promoting China's semiconductor industry. The overall advancement of lighting technology has also played a crucial role in the arrival of the era of semiconductor lighting.
On August 30th, the 8th High-tech LED Industry Summit held in conjunction with the High-tech LED Boutique Exhibition was held in the Century Hall of the Shanghai International Convention Center. The technical section of the forum revolves around "LED Lighting Technology - Problems and Solutions", LED lighting design and application engineering - the theme of deciding the segmentation field, etc. The sapphire production process in the whole industry chain of LED, middle and lower reaches, LED epitaxial chip technology at home and abroad, phosphor, detection equipment, LED devices and modules, and OLED From the point of view to the topic, I shared a comprehensive key technology with the guests. Participants expressed that it was a very rare training and promotion opportunity.
Su Weimai, vice president of Yaweilang Optoelectronics, pointed out that the current chips are mainly divided into low-voltage DC chips and high-voltage DC chips. Among them, the low-voltage DC chip includes a front-mounted structure chip, a vertical structure chip, and a 3-dimensional (gold-free) vertical structure chip. The high voltage DC chip includes a body mounted structure chip. From the perspective of the substrate, the current technical route of the entire industry, the mainstream substrate is sapphire and SiC, Si substrate is the future hope.
The main breakthrough in chip technology is to improve LM/W & LM/$. Possible breakthrough points include: 1. High current density driving chip; 2. Three-dimensional vertical structure chip; 3. Vertical structure high voltage AC/DC chip; 4. Green light IQE enhancement (Green-Gap); 5. Substrate: silicon substrate, Graphite substrate, GaN, AlN and other substrates. The most important advantage of a three-dimensional vertical structure chip is that there is no inductive effect. The advantage of the vertical structure high-voltage AC-DC chip is mainly to increase the current drive and reduce the cost of the chip. The high voltage chip will reduce the cost of the transformer part, and the AC chip can reduce the cost of the rectification part. Alternatively, the light extraction efficiency can be improved by patterning the substrate and dissimilar the shape of the chip.
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